Design And Reuse

BOS Semiconductors to Participate in Auto China 2026, Showcasing Physical AI and Automotive AI SOC Technologies

BOS Semiconductors, a fabless company specializing in Physical AI and automotive AI SOCs, announced that it will participate ...
Design And Reuse

Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums

Analog Bits continues to develop innovative mixed signal IP in TSMC N2P process technology, with integrated LDOs, pinless remote PVT sensors, and microwatt class and high-performance LC PLLs​​​​​​​ ...
Design And Reuse

European Commission greenlights €211 million funding for Cambridge graphene photonics spinout

University spinout, CamGraPhIC, has received the EC greenlight for €211 million funding from Italy to support the development of photonic optical transceivers based on graphene.
Design And Reuse

Japanese Government Provides Additional 5.9 Trillion Won to Rapidus

Cumulative subsidies reach 22 trillion won as Japan aims to challenge TSMC, Samsung with 2-nanometer trial production by year-end. The Japanese government has decided to provide a ...
Design And Reuse

Synopsys Solutions Support NASA's Artemis Program with Spacesuit Analysis and Communication System Development

NASA's Johnson Space Center in Houston taps Synopsys and Electro Magnetic Applications, Inc. (EMA) to research Artemis spacesuit charging levels resulting from exposure to the lunar environment ...
Design And Reuse

Three Foundry Companies and the "Everyone’s Challenge Fabless" Initiative… Full-Scale Support for Startups

Selecting five promising fabless companies to prioritize MPW process access and provide up to 200 million won in production funding. The Ministry of SMEs and Startups announced on ...
Design And Reuse

Samsung Foundry and Cadence: Accelerating Chiplet Solutions for Physical AI

Physical AI workloads, such as real-time vision processing on a camera module, AI-enhanced radar in autonomous vehicles, smart manufacturing equipment, and sensor‑based systems, directly benefit from ...
Design And Reuse

Cadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing

At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins ...
Design And Reuse

Topology and Data Movement in Multi-Die Design

Whilst chiplets garner much interest, many remain cautious about adopting multi-die solutions because the technology ...
Design And Reuse

8 Wi-Fi security guidelines issued by Wireless Broadband Alliance

The Wireless Broadband Alliance (WBA) has released guidelines to strengthen security, privacy, and trust across Wi-Fi networks. These guidelines help organizations reduce exposure to common Wi-Fi ...
Design And Reuse

Sofics and Alcyon Photonics Partner to Support Next-Generation Photonic Systems

Collaboration brings together robust ESD protection for electrical ICs and foundry-validated IP for photonic ICs, helping mutual customers accelerate photonics product development. Aalter, Belgium / ...
Design And Reuse

DeepX to produce next AI chip using Samsung Foundry’s 2-nanometer process

DeepX, a Korean chip design startup valued at more than 1 trillion won ($677 million), will start production of its next AI chip next year using Samsung Foundry’s 2-nanometer process.